Title:
FILM, LAMINATE, PLASMA PROCESSING APPARATUS, AND MANUFACTURING METHOD OF LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/062923
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a film that has excellent adhesion for bonding members, even at an extremely low temperature of about -50°C, and has high cold/heat cycle reliability. The invention relates to a film containing a binder resin (SA) and a heat conductive filler (SD), wherein: the heat conductive filler (SD) contains a first heat conductive filler (SD1) and a second heat conductive filler (SD2); the average primary particle diameter of the first heat conductive filler (SD1) is 1.0-200 μm; the average primary particle diameter of the second heat conductive filler (SD2) is 0.010 μm or more and less than 1.0 μm; the shear strain at -50°C is 0.70-20; and the heat conductivity at 25°C is 0.10-5.0 W/(m·K).
Inventors:
TANIGAKI YUGO (JP)
SHIMADA AKIRA (JP)
TANAKA DAISAKU (JP)
SAKABE YOHEI (JP)
SHIMADA AKIRA (JP)
TANAKA DAISAKU (JP)
SAKABE YOHEI (JP)
Application Number:
PCT/JP2023/032488
Publication Date:
March 28, 2024
Filing Date:
September 06, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08L101/02; B32B27/00; B32B27/18; C08G73/10; C08J5/18; C08K3/013; C08K5/1515; C08K5/17; C08L79/08; H01L21/683
Domestic Patent References:
| WO2012046814A1 | 2012-04-12 | |||
| WO2013065758A1 | 2013-05-10 | |||
| WO2021079900A1 | 2021-04-29 | |||
| WO2023068044A1 | 2023-04-27 |
Foreign References:
| JP2021091783A | 2021-06-17 | |||
| JP2021091784A | 2021-06-17 | |||
| JP2018053092A | 2018-04-05 |
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