Title:
FILM FORMING APPARATUS AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/084725
Kind Code:
A1
Abstract:
A film forming apparatus (1) includes a chamber (101), a stage (190) that supports a substrate, a source gas supply unit that supplies source gas into the chamber (101), a high-frequency application unit (102) that generates plasma in the chamber (101) by applying a high-frequency electromagnetic field to the source gas supplied into the chamber (101), a vacuum pump (181) for evacuating the gas including the source gas in the chamber (101), and a bias application unit (106) that applies a high-frequency bias to the substrate. An introduction port (1012a) is provided in a portion of the peripheral wall of the chamber (101) located on the -X direction side of the projection area of the substrate in the Z-axis direction, and an exhaust port (1011a) is provided in a portion of the peripheral wall located on the +X direction side of the projection area.
Inventors:
WADA KAZUO (JP)
Application Number:
PCT/JP2023/017417
Publication Date:
April 25, 2024
Filing Date:
May 09, 2023
Export Citation:
Assignee:
SELVAC CORP (JP)
International Classes:
C23C16/455; H01L21/31; H01L21/316; H01L21/318
Foreign References:
| JP2020009935A | 2020-01-16 | |||
| JP2005019977A | 2005-01-20 | |||
| JP2006073354A | 2006-03-16 |
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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