Title:
FILM FORMATION METHOD AND FILM FORMATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070696
Kind Code:
A1
Abstract:
This film formation method includes (A) and (B) below. (A) A substrate is prepared, the substrate having, in different regions of the surface thereof, a first film and a second film formed from a different material than the first film. (B) An organic compound gas and an oxygen-containing gas that does not contain an OH group are supplied into a processing vessel housing the substrate, whereby a self-assembled monolayer is selectively formed on the surface of the second film rather than on the surface of the first film.
Inventors:
KAWANO YUMIKO (JP)
AZUMO SHUJI (JP)
AZUMO SHUJI (JP)
Application Number:
PCT/JP2023/033371
Publication Date:
April 04, 2024
Filing Date:
September 13, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/316; C23C16/04; C23C16/42
Foreign References:
| JP2022055462A | 2022-04-08 | |||
| JP2021052071A | 2021-04-01 | |||
| US20170018458A1 | 2017-01-19 | |||
| JP2013520028A | 2013-05-30 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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