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Patent Searching and Data


Title:
FILLER-CONTAINING FILM
Document Type and Number:
WIPO Patent Application WO/2019/235560
Kind Code:
A1
Abstract:
This filler-containing film 1A has a filler 2 and fine solid matter 3 that are retained in an insulating resin layer 10, the filler 2 repeating a predetermined array in plan view. The filler repetition pitch rate after thermocompression bonding relative to that before thermocompression bonding is within 300% if the filler-containing film 1A is clamped with smooth surfaces and thermocompression-bonded under predetermined thermocompression bonding conditions. One method for producing this filler-containing film 1A includes: a step for forming an insulating resin layer 11 on a release substrate 20a, a step for pressing in on the filler 2 from a surface on the side of the insulating resin layer 11 opposite the release substrate 20a; and a step for layering the insulating resin layer 11 having the pushed-in filler 2 and a different insulating resin layer 12 from the insulating resin layer 11 so that the release substrates 20a, 20b thereof are the outer side. According to this filler-containing film 1A, disordered filler arraying is suppressed in a case where the film 1A is thermocompression-bonded onto an article.

Inventors:
MATSUBARA MAKOTO (JP)
Application Number:
PCT/JP2019/022492
Publication Date:
December 12, 2019
Filing Date:
June 06, 2019
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J7/35; C09J7/10; C09J11/04; C09J201/00; H01R11/01; H01R43/00
Foreign References:
JP6187665B12017-08-30
JP2017204463A2017-11-16
JP2018081906A2018-05-24
JP2018078096A2018-05-17
JP2015195198A2015-11-05
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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