Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
EMBEDDING METHOD AND FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/080169
Kind Code:
A1
Abstract:
An embedding method according to one embodiment of the present disclosure is for embedding a metal oxide film in a recess formed in the surface of a substrate, the method including: a step for forming the metal oxide film by supplying a metal raw material gas and an oxidant to the recess; and a step for etching a portion of the metal oxide film by supplying, to the metal oxide film, an etching gas containing ＳＯＣｌ２ and/or （ＣＯＣｌ）２.

More Like This:
JPH08279507SEMICONDUCTOR DEVICE,ITS PREPARATION,THREE ELEMENT DIELECTRIC COMPOUND,ITS METHOD OF APPLICATION AND PREPARATION OF DIELECTRIC COMPOUND LAYER
JP5295399Semiconductor device manufacturing method, substrate processing method and substrate processing equipment
JPWO2004075296Manufacturing method of ferroelectric capacitor
Inventors:
HASEGAWA TOSHIO (JP)
ISHII KATSUTOSHI (JP)
Application Number:
PCT/JP2021/036643
Publication Date:
April 21, 2022
Filing Date:
October 04, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/316; C23C16/04; C23C16/40; H01L21/3065; H01L21/31
Domestic Patent References:
WO2020050124A12020-03-12
WO2017030150A12017-02-23
Foreign References:
JP2019501518A2019-01-17
JP2015019075A2015-01-29
JP2020059916A2020-04-16
JP2015149461A2015-08-20
JPH05291204A1993-11-05
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: LIGHT-RECEIVING APPARATUS AND ELECTRONIC DEVICE

Next Patent: INSPECTION METHOD AND INSPECTION DEVICE FOR CONNECTING ROD