EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

Title:

EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/195871

Kind Code:

A1

Abstract:

Provided are an embedded substrate, a circuit board assembly, and an electronic device. The embedded substrate of the present application comprises an insulating layer, and an electronic element and a conductive connecting body which are embedded inside the insulating layer. The conductive connecting body is electrically connected to the electronic element, and the conductive connecting body comprises at least one fuse unit, the fuse unit comprising a fusible structure and two electrical connection ends, wherein in the direction of an electrical path of the conductive connection body, the fusible structure is connected between the two electrical connection ends, and the fusible structure is used for blowing a fuse when a flowing current exceeds a preset current threshold, so as to disconnect the electrical connection between the electronic element and an external connection end. The present application has the advantages of lower maintenance and replacement costs in terms of preventing burning by a current, and of a relatively compact volume.

Inventors:

SHEN CHAO (CN)
XIANG ZHIQIANG (CN)
LIAO XIAOJING (CN)

Application Number:

PCT/CN2020/082148

Publication Date:

October 07, 2021

Filing Date:

March 30, 2020

Export Citation:

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Assignee:

HUAWEI TECH CO LTD (CN)

International Classes:

H01L23/62; H01H85/04

Foreign References:

CN110310930A	2019-10-08
CN205911276U	2017-01-25
CN102792410A	2012-11-21
CN1551276A	2004-12-01
JP2007250347A	2007-09-27

Other References: