Title:
ELECTROPLATING DEVICE AND ELECTROPLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/156420
Kind Code:
A1
Abstract:
An electroplating device and an electroplating method. The electroplating device comprises an electroplating unit for electroplating a production board; the electroplating unit comprises an electrolyte channel for spray-plating an electrolyte to the production board and an electroplating assembly provided on the outer surface of the electrolyte channel; the electroplating assembly comprises an anode provided on the outer surface of the electrolyte channel and a suction channel provided in the anode and used for absorbing the electrolyte in a spray-plating reverse direction. The electrolyte channel and the electroplating assembly are used in combination, so that the electrolyte can be uniformly electroplated on the production board.
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Inventors:
LANG MARCUS ELMAR (CN)
Application Number:
PCT/CN2021/137064
Publication Date:
July 28, 2022
Filing Date:
December 10, 2021
Export Citation:
Assignee:
SIMETRIC SEMICONDUCTOR SOLUTIONS CO LTD (CN)
International Classes:
C25D5/08; C25D17/10
Foreign References:
| CN112899743A | 2021-06-04 | |||
| CN103025922A | 2013-04-03 | |||
| CN103590080A | 2014-02-19 | |||
| CN107012489A | 2017-08-04 | |||
| CN102181895A | 2011-09-14 | |||
| JPH1060684A | 1998-03-03 |
Attorney, Agent or Firm:
SHENZHEN TALENT PATENT SERVICE (CN)
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