Title:
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/154396
Kind Code:
A1
Abstract:
An electronic device according to various embodiments of the present disclosure is disclosed. An electronic device according to various embodiments of the present disclosure may comprise: a housing for accommodating a printed circuit board; a cover which coupled to the housing, and which includes a coupling protrusion protruding toward one side of the housing so as to be accommodated in the housing, and a coupling hole formed in the coupling protrusion; a fastening pin arranged in the coupling hole and coupled to the housing; and a sealing member arranged between the fastening pin and an inner wall forming the coupling hole, so as to seal the coupling hole. Other various embodiments are possible.
Inventors:
PARK SUNGEUN (KR)
Application Number:
PCT/KR2022/000324
Publication Date:
July 21, 2022
Filing Date:
January 07, 2022
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G04B37/11; F16J15/10; G04B37/08; G04G99/00
Foreign References:
| KR20170020149A | 2017-02-22 | |||
| JP2002214366A | 2002-07-31 | |||
| KR20190074985A | 2019-06-28 | |||
| KR20160143122A | 2016-12-14 | |||
| JP2001153970A | 2001-06-08 |
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)
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