Title:
ELECTRONIC DEVICE INCLUDING STRUCTURE FOR DISSIPATING HEAT GENERATED IN ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/053911
Kind Code:
A1
Abstract:
An electronic device according to an embodiment comprises: a hinge structure which includes a first hinge plate, a second hinge plate rotatable with respect to the first hinge plate, and a third hinge plate separated from the second hinge plate and rotatable with respect to the first hinge plate; a display; a layer which is attached to the display and includes a first heat dissipation member comprising a first segment, a second segment spaced apart from the first segment, and a plurality of third segments disposed between the first segment and the second segment and spaced apart from each other; and a first conductive member, wherein the first conductive member overlaps a part of the first segment and a part of the second segment in an unfolded state of the electronic device.
Inventors:
JUNG HYERAN (KR)
KANG SEUNGHOON (KR)
PARK YOONSUN (KR)
KANG SEUNGHOON (KR)
PARK YOONSUN (KR)
Application Number:
PCT/KR2023/012447
Publication Date:
March 14, 2024
Filing Date:
August 22, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K7/20; F16C11/04; G06F1/16; H04M1/02
Foreign References:
| KR20200077931A | 2020-07-01 | |||
| KR20210142456A | 2021-11-25 | |||
| KR20220105483A | 2022-07-27 | |||
| KR20200108754A | 2020-09-21 | |||
| KR20220043668A | 2022-04-05 |
Attorney, Agent or Firm:
KWANG AND JANG INTELLECTUAL PROPERTY LAW FIRM (KR)
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