ELECTRONIC DEVICE COMPRISING THERMOELECTRIC COOLER

WIPO Patent Application WO/2024/072005

A1

An electronic device according to an embodiment disclosed in the present document may comprise: a first housing; a second housing; a hinge structure; an electrical component included in the first housing; a first plate included in the first housing and coming in contact with one surface of the electrical component; at least one thermoelectric cooler included in the second housing and having a cooling surface in contact with the first plate; a second plate included in the second housing and coming in contact with a heating surface of the thermoelectric cooler; and a processor. The processor may measure a temperature of the electrical component or a temperature at a designated point of the first housing around the electrical component, and drive the thermoelectric cooler on the basis of the measured temperature so that heat generated in the electrical component can be transferred to the second plate and dissipated therefrom. Another embodiment understood through the specification is also possible.

PARK YOONSUN (KR)
KANG SEUNGHOON (KR)
YUN HAJOONG (KR)
YI SEUNGA (KR)
JUNG HYERAN (KR)

PCT/KR2023/014838

April 04, 2024

September 26, 2023

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SAMSUNG ELECTRONICS CO LTD (KR)

H05K7/20; F16C11/04; H04M1/02; H10N10/13; H10N10/17; H10N10/80

KR20210142456A	2021-11-25
KR101082580B1	2011-11-10
JP2022110923A	2022-07-29
JP2018019001A	2018-02-01
US5872699A	1999-02-16

BAE, KIM & LEE IP (KR)

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