Title:
ELECTRONIC DEVICE COMPRISING STRUCTURE FOR COOLING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085541
Kind Code:
A1
Abstract:
An electronic device according to an embodiment comprises: a printed circuit board including an outer surface on which an electronic component is disposed; an actuator including a first surface facing the outer surface of the printed circuit board, a second surface opposite to the first surface, and a third surface connecting the first surface and the second surface to each other; a first case surrounding at least a part of the third surface and the first surface; a second case coming into contact with the first case; and a heat dissipation chamber sealed by the first case and the second case so as to dissipate heat transferred from the electronic component to the second case, wherein the actuator is configured to transfer air from the outside of the first case toward the first case partially sealing the heat dissipation chamber.
Inventors:
LEE HAEJIN (KR)
Application Number:
PCT/KR2023/015778
Publication Date:
April 25, 2024
Filing Date:
October 13, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G02B27/01; G06F1/16; G06F1/20
Foreign References:
| JP2010093986A | 2010-04-22 | |||
| JP2004172224A | 2004-06-17 | |||
| JP2007218241A | 2007-08-30 | |||
| JP2018137437A | 2018-08-30 | |||
| JP2006336641A | 2006-12-14 |
Attorney, Agent or Firm:
KWANG AND JANG INTELLECTUAL PROPERTY LAW FIRM (KR)
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