Title:
ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/048212
Kind Code:
A1
Abstract:
Provided is an electronic component that minimizes deterioration of the characteristics of an LC resonator formed on an element while making it possible to enhance the close adhesion of a shield conductor formed on the outer surface of the element to the element. The electronic component comprises: an element that has a layered substrate with insulating properties, a main surface, and a side surface; an LC resonator having an inductor conductor formed on the substrate and a capacitor conductor formed on the substrate and electrically connected with the inductor conductor; a shield conductor formed on the main surface and electrically connected with a ground; an exterior electrode formed on the main surface and electrically connected with the LC resonator; and a protective layer that spans the interface between the element and the shield conductor formed on the main surface and covers the main surface and the shield conductor formed on the main surface.
Inventors:
OIE HIROFUMI (JP)
TERAMOTO MASAHIRO (JP)
TERAMOTO MASAHIRO (JP)
Application Number:
PCT/JP2022/035327
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/36; H01F17/00; H01F27/00; H01F27/29; H01G2/22; H01G4/40; H05K9/00
Domestic Patent References:
| WO2018047488A1 | 2018-03-15 | |||
| WO2012132880A1 | 2012-10-04 |
Foreign References:
| JP2002057543A | 2002-02-22 | |||
| JP2004303946A | 2004-10-28 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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