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Patent Searching and Data


Title:
ELECTRONIC COMPONENT AND FILM FORMING METHOD
Document Type and Number:
WIPO Patent Application WO/2024/079963
Kind Code:
A1
Abstract:
The present invention has an element body 20, an external electrode covering a portion of an outer surface (21) of the element body (20), and a protective film (30) of aluminum oxide. The protective film (30) is positioned between the element body (20) and the external electrode. The thickness of the protective film (30) in a direction perpendicular to the outer surface (21) of the element body (20) is defined as the film thickness (TP). The protective film (30) is viewed in a cross-section orthogonal to the outer surface (21) of the element body (20) at a location covered by the external electrode. When the average value and standard deviation of the film thickness (TP) are calculated in a range of 1 μm in a direction along the outer surface (21) of the element body (20), the ratio of the standard deviation to the average value is 0.4 or greater.

Inventors:
OOSHIMA TOMOYA (JP)
TOKIEDA KOJIRO (JP)
HOSHINO YUUTA (JP)
YAMADA KOICHI (JP)
SASAKI MIKI (JP)
Application Number:
PCT/JP2023/027615
Publication Date:
April 18, 2024
Filing Date:
July 27, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01C7/04; H01C7/02; H01F27/29; H01F27/32; H01G4/30
Foreign References:
JP2007242995A2007-09-20
JPH01134901A1989-05-26
JP2021027202A2021-02-22
JP2017195309A2017-10-26
JPH05283206A1993-10-29
JPH0696907A1994-04-08
Attorney, Agent or Firm:
FUKUI Hiroshi (JP)
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