ELECTROMAGNETIC WAVE ATTENUATING FILM

WIPO Patent Application WO/2024/053503

A1

The purpose of the present invention is to simply and inexpensively obtain an electromagnetic wave attenuating film which is imparted with translucency and transparency, and which exhibits little shift in absorption peak frequency as well as little change in frequency characteristics and angular characteristics over time.　To fulfill this purpose, the electromagnetic wave attenuating film according to the present invention comprises: an electromagnetic wave attenuating base which includes a dielectric substrate that has a front surface and a back surface, and a mesh-like thin film conductive layer having a mesh-like pattern formed from conductive thin film fine wires and arranged on both the front and back surfaces of the dielectric substrate, said layer being such that ends of the fine wires protrude therefrom or such that the fine wires surround the outermost periphery thereof; a support layer arranged on the back surface of the electromagnetic wave attenuating base; and a mesh-like flat plate inductor formed from conductive thin film fine wires arranged on the back surface of the support layer, wherein the mesh-like thin film conductive layer includes a plurality of mesh-like conductive elements.

IMAI MIHO (JP)
AOKI ATSUKO (JP)

PCT/JP2023/031413

March 14, 2024

August 30, 2023

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TOPPAN HOLDINGS INC (JP)

H05K9/00; B32B3/24; B32B7/025; B32B15/04; B32B27/18; B32B27/30; H01Q17/00

WO2022107637A1

2022-05-27

JP2021082896A	2021-05-27
JP2010003964A	2010-01-07
JP2010118552A	2010-05-27

DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)

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