Title:
ELECTROMAGNETIC MODELING METHOD FOR POWER NETWORK FOR CHIP PACKAGING, AND SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/082578
Kind Code:
A1
Abstract:
The present invention belongs to the field of chip packaging. Disclosed are an electromagnetic modeling method for a power network for chip packaging, and a system. Aiming at an existing problem of it being impossible to take into account both accuracy and speed in performing electromagnetic field modeling on a large-scale power network, the present invention provides an electromagnetic modeling method for a power network for chip packaging. The method comprises: performing decomposition processing on an initial power network to obtain several decomposition regions; performing electromagnetic field solving on each decomposition region to obtain several sub-magnetic field models; performing a circuit connection on each sub-magnetic field model itself, and then performing a circuit connection between two adjacent sub-magnetic field models to form a complete circuit connection; and performing circuit solving on the complete circuit connection to generate a complete electromagnetic field model. In the present invention, by means of decomposing and then solving a power network, time can be reduced; and a required large-scale electromagnetic field model is obtained by means of performing a circuit connection on sub-magnetic field models, which are obtained by means of decomposition and solving, thus ensuring the accuracy. The system of the present invention has a simple structure, and operates stably.
Inventors:
DAI WENLIANG (CN)
LING FENG (CN)
ZHONG ZHANGMIN (CN)
JIANG LIGUO (CN)
LING FENG (CN)
ZHONG ZHANGMIN (CN)
JIANG LIGUO (CN)
Application Number:
PCT/CN2023/087432
Publication Date:
April 25, 2024
Filing Date:
April 11, 2023
Export Citation:
Assignee:
XPEEDIC CO LTD (CN)
International Classes:
G06F30/33
Foreign References:
| CN114021517A | 2022-02-08 | |||
| CN114547854A | 2022-05-27 | |||
| CN112329303A | 2021-02-05 | |||
| JP2007249642A | 2007-09-27 | |||
| CN115358173A | 2022-11-18 |
Attorney, Agent or Firm:
SHANGHAI LEHONG PATENT AGENCY (GENERAL PARTNERSHIP) (CN)
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