Title:
ELECTRODEPOSITION FLUID AND METHOD FOR PRODUCING INSULATING COATING FILM
Document Type and Number:
WIPO Patent Application WO/2022/154052
Kind Code:
A1
Abstract:
This electrodeposition fluid is for electrodepositing a film on an electroconductive substrate, and comprises water, a dispersion medium, and a solid component, wherein the solid component comprises a polyimide-based resin and a fluororesin, the content of the fluororesin in the solid component being in the range of 72-95 mass%, and the solid component is dispersed in both the water and the dispersion medium so as to have an average particle diameter of 50-500 nm and has a standard deviation of particle diameter of 250 nm or less.
Inventors:
IIDA SHINTARO (JP)
YAMASAKI KAZUHIKO (JP)
YAMASAKI KAZUHIKO (JP)
Application Number:
PCT/JP2022/000972
Publication Date:
July 21, 2022
Filing Date:
January 13, 2022
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C09D5/44; C09D7/20; C09D127/12; C09D127/18; C09D179/08; C25D13/06; H01B7/02
Foreign References:
| JP2018131562A | 2018-08-23 | |||
| JP2019096607A | 2019-06-20 | |||
| JP2001294815A | 2001-10-23 | |||
| JP2002298674A | 2002-10-11 | |||
| JP2007197535A | 2007-08-09 | |||
| JP2021003765A | 2021-01-14 | |||
| JP2015156378A | 2015-08-27 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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