ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION STRUCTURE USING SAME

Title:

ELECTROCONDUCTIVE MATERIAL, AND CONNECTION METHOD AND CONNECTION STRUCTURE USING SAME

Document Type and Number:

WIPO Patent Application WO/2013/038817

Kind Code:

A1

Abstract:

Provided are an electroconductive material having excellent heat resistance and ensuring that a first metal and a second metal have good diffusivity in a soldering step when the material is used, for example, as a solder paste, that a high-melting intermetallic compound is formed at a low temperature and in a short time, and that the first metal leaves substantially no residue after soldering. Also provided are a connection method and connection structure using the material and having high connection reliability. A configuration is adopted comprising a metal component containing a first metal and a second metal having a higher melting point than the first metal, the configuration being provided with a requirement that the first metal be Sn or an alloy comprising Sn, and the second metal be a Cu-Cr alloy that forms with the first metal an intermetallic compound exhibiting a melting point of 310°C or above. The first metal can be Sn alone or an alloy comprising Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.

Inventors:

NAKANO KOSUKE (JP)
TAKAOKA HIDEKIYO (JP)

Application Number:

PCT/JP2012/068976

Publication Date:

March 21, 2013

Filing Date:

July 26, 2012

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)
NAKANO KOSUKE (JP)
TAKAOKA HIDEKIYO (JP)

International Classes:

B23K35/14; B23K35/22; B23K35/26; C22C9/00; C22C13/00; C22C13/02; H05K3/34

Domestic Patent References:

WO2003021664A1	2003-03-13
WO2011027659A1	2011-03-10
WO2007125861A1	2007-11-08

Foreign References:

JP2009506203A	2009-02-12
JP2003311469A	2003-11-05
JPH1025562A	1998-01-27
JP2002254194A	2002-09-10

Other References: