Title:
ELECTROCONDUCTIVE ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2024/071400
Kind Code:
A1
Abstract:
The present invention provides an electroconductive adhesive layer which is capable of exhibiting sufficient adhesion strength to various adherends even if compression bonding is performed at low temperatures for a short period of time. This electroconductive adhesive layer (1) contains a binder component (11) and metal particles A (12a) that have a melting point of 170°C or less; and the metal particles A (12a) protrude from the surface. It is preferable that this electroconductive adhesive layer (1) additionally contains metal particles B (12b) which can be alloyed with the metal particles A (12a); and it is also preferable that this electroconductive adhesive layer (1) additionally contains solder particles C (12c). In addition, it is preferable that the metal particles A (12a) are spherical.
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Inventors:
HARUNA YUUSUKE (JP)
Application Number:
PCT/JP2023/035699
Publication Date:
April 04, 2024
Filing Date:
September 29, 2023
Export Citation:
Assignee:
TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)
International Classes:
H01B1/22; C09J7/30; C09J9/02; C09J201/00
Domestic Patent References:
| WO2022024757A1 | 2022-02-03 | |||
| WO2022202560A1 | 2022-09-29 |
Foreign References:
| JP2006298954A | 2006-11-02 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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