Title:
EASILY ADHESIVE POLYAMIDE FILM AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2024/071123
Kind Code:
A1
Abstract:
[Problem] To provide an easily adhesive polyamide film that is superior in terms of blocking resistance, printability, transparency, etc. while maintaining high adhesion even after hot water treatment. [Solution] The present invention relates to an easily adhesive polyamide film in which a primer layer is formed on at least one side of a polyamide base film, the polyamide film being characterized by (1) the primer layer containing a polyurethane resin A having no silanol group and a polyurethane resin B having a silanol group and (2) the polyurethane resin A, and the polyurethane resin B having glass transition temperatures (Tg) that are different from each other.
Inventors:
KAJITA AKITO (JP)
KUROSAWA AKIKO (JP)
KUROSAWA AKIKO (JP)
Application Number:
PCT/JP2023/034956
Publication Date:
April 04, 2024
Filing Date:
September 26, 2023
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
B32B27/34; B32B27/40
Domestic Patent References:
| WO2010110282A1 | 2010-09-30 |
Foreign References:
| JP2021047295A | 2021-03-25 | |||
| JP2022034576A | 2022-03-04 | |||
| JP2014208443A | 2014-11-06 |
Attorney, Agent or Firm:
FUJII, Atsushi (JP)
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