Title:
DUSTPROOF STRUCTURE FOR MEMS DEVICE AND MEMS MICROPHONE PACKAGING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/135125
Kind Code:
A1
Abstract:
Disclosed are a dustproof structure for a MEMS device and a MEMS microphone packaging structure. The dustproof structure for a MEMS device comprises a grid film and a carrier, wherein the grid film is provided with a fixed connection area, a buffer area and a sound transmission area, the buffer area surrounds the sound transmission area, the fixed connection area surrounds the buffer area, the fixed connection area is located at an edge of the grid film, and a through hole penetrating the grid film is provided in the buffer area; and the carrier is provided with a through opening, the carrier is connected to one side of the fixed connection area, and the opening corresponds to positions of the buffer area and the sound transmission area.
Inventors:
LIN YUJING (CN)
Application Number:
PCT/CN2020/099351
Publication Date:
July 08, 2021
Filing Date:
June 30, 2020
Export Citation:
Assignee:
WEIFANG GOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
H04R19/00; H04R19/04; H04R31/00
Foreign References:
| CN110944276A | 2020-03-31 | |||
| CN111147992A | 2020-05-12 | |||
| CN111147995A | 2020-05-12 | |||
| CN111163410A | 2020-05-15 | |||
| CN201563214U | 2010-08-25 | |||
| CN110572762A | 2019-12-13 | |||
| US20150118780A1 | 2015-04-30 | |||
| US20180070162A1 | 2018-03-08 |
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