DIAPHRAGM VALVE, FLUID CONTROL DEVICE, SEMICONDUCTOR PRODUCTION DEVICE, AND SEMICONDUCTOR PRODUCTION METHOD

Title:

DIAPHRAGM VALVE, FLUID CONTROL DEVICE, SEMICONDUCTOR PRODUCTION DEVICE, AND SEMICONDUCTOR PRODUCTION METHOD

Document Type and Number:

WIPO Patent Application WO/2016/002514

Kind Code:

A1

Abstract:

The radius of curvature (SR2) of a surface that comes in contact with a diaphragm (5) of a diaphragm press (6) is at least 30 mm. The taper angle (θ) for a lower surface of a press adapter (8) is no more than 10° relative to a flat section (14b) of a floor surface (14) of a recessed section (2c) of a body (2).

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Inventors:

WATANABE KAZUNARI (JP)
SHIKATA IZURU (JP)

Application Number:

PCT/JP2015/067432

Publication Date:

January 07, 2016

Filing Date:

June 17, 2015

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Assignee:

FUJIKIN KK (JP)

International Classes:

F16K7/12; F16K7/14; F16K7/16; H01L21/205; H01L21/3065

Foreign References:

JP2012026577A	2012-02-09
JP2006083959A	2006-03-30
JP2014009765A	2014-01-20

Attorney, Agent or Firm:

WATANABE, Akira et al. (JP)
Akira Watanabe (JP)

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