Title:
DEVICE FOR PROCESSING SUBSTRATE AND METHOD FOR PROCESSING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/085563
Kind Code:
A1
Abstract:
The present invention provides a method for processing a substrate. A method for processing a substrate, according to one embodiment, supplies a gas to a processing space in a chamber, and excites the gas to remove a plurality of thin films formed on a substrate and a hard mask film among hard mask films located on top of the thin films, wherein the hard mask film may include boron and/or a metal other than carbon.
Inventors:
CHO HYEONG SHIN (KR)
PARK SANG JONG (KR)
LEE JUN HYEOK (KR)
LEE JU SEOK (KR)
PARK SANG JONG (KR)
LEE JUN HYEOK (KR)
LEE JU SEOK (KR)
Application Number:
PCT/KR2023/015931
Publication Date:
April 25, 2024
Filing Date:
October 16, 2023
Export Citation:
Assignee:
PSK INC (KR)
International Classes:
H01L21/311; H01L21/033; H01L21/67
Foreign References:
| KR20140089383A | 2014-07-14 | |||
| KR20210148674A | 2021-12-08 | |||
| KR20210065199A | 2021-06-03 | |||
| KR20160086375A | 2016-07-19 | |||
| KR20200004399A | 2020-01-13 |
Attorney, Agent or Firm:
KWON, Hyuk-Soo et al. (KR)
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