Title:
DEVICE FOR PLANARIZING SEMICONDUCTOR LAYERS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES
Document Type and Number:
WIPO Patent Application WO/2024/069972
Kind Code:
A1
Abstract:
A device for planarizing plural semiconductor layers includes plural wheels, each having a coplanar polishing surface extending transversely to an axis of rotation, in which the polishing surface is configured to contact at least one of plural semiconductor layers formed in a strip configuration on a wafer surface, and in which the plural wheels are arranged along a direction intersecting a direction of extension of the plural semiconductor layers; a rotating device configured to synchronously rotate the plural wheels around their respective axes of rotation; a moving device configured to relatively move the plural wheels along the direction of extension of the semiconductor layers; and a thickness measurement arranged in a space formed between two adjacent wheels among the plural wheels.
Inventors:
GANDROTHULA SRINIVAS (JP)
DAWUTI MAIHEMUTIJIANG (JP)
DAWUTI MAIHEMUTIJIANG (JP)
Application Number:
PCT/JP2022/036816
Publication Date:
April 04, 2024
Filing Date:
September 30, 2022
Export Citation:
Assignee:
SANOH IND CO LTD (JP)
International Classes:
H01L21/304
Domestic Patent References:
| WO2019225378A1 | 2019-11-28 |
Foreign References:
| JP2021186905A | 2021-12-13 | |||
| JP2008028259A | 2008-02-07 | |||
| JP2004356609A | 2004-12-16 | |||
| JP2017098322A | 2017-06-01 | |||
| JP2010064196A | 2010-03-25 | |||
| JP2010286342A | 2010-12-24 | |||
| KR20190079121A | 2019-07-05 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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