Title:
DEVICE AND METHOD FOR POLISHING WAFER
Document Type and Number:
WIPO Patent Application WO/2023/097488
Kind Code:
A1
Abstract:
A device for polishing a wafer, the device comprising: a fixing device (110) for fixing a wafer (140). A polishing platform comprises n polishing assemblies (130), a first plane of each polishing assembly comprising a polishing region (133) for polishing a wafer, and n being a positive integer greater than or equal to 1; a first region (144) of a plane to be polished of the wafer fixed on the fixing device (110) is in contact with the polishing region (133), and a second region (143) of the plane to be polished of the wafer is arranged opposite a closed or semi-closed space formed by the n polishing assemblies, wherein the second region (143) is a circular region with a radius r taking the center of the plane to be polished (141) as a circle center, the first region (144) is the region between the edge of the second region and the edge of the wafer, and r is a number greater than 0 and less than the radius of the plane to be polished; and the n polishing assemblies and/or the fixing device rotate with the center of the plane to be polished as a rotation center. Further provided is a method for polishing a wafer. The device and method for polishing the wafer can effectively remove aluminum residues at the edge of the wafer.
Inventors:
FAN RONGWEI (CN)
LIN JUN (CN)
LIN JUN (CN)
Application Number:
PCT/CN2021/134546
Publication Date:
June 08, 2023
Filing Date:
November 30, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/304; B24B37/11; H01L21/463
Foreign References:
| CN112497046A | 2021-03-16 | |||
| TW201935542A | 2019-09-01 | |||
| CN111300259A | 2020-06-19 | |||
| TW201836767A | 2018-10-16 | |||
| CN113510609A | 2021-10-19 | |||
| US6048254A | 2000-04-11 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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