Title:
DEVICE COMPRISING THERMALLY ANISOTROPIC CONDUCTIVE CHANNELS AND THERMALLY INSULATING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/000250
Kind Code:
A1
Abstract:
A device comprising a region that includes a component configured to generate heat and a thermally conductive layer coupled to the region, where the thermally conductive layer includes a plurality of segmented thermally anisotropic conductive channels. Each segmented thermally anisotropic conductive channel from the plurality of segmented thermally anisotropic conductive channels is aligned in a first direction. Each segmented thermally anisotropic conductive channel from the plurality of segmented thermally anisotropic conductive channels is configured to provide heat transfer capabilities in the first direction. The thermally conductive layer is configured to (i) reduce the junction temperature of the component and/or (ii) reduce a surface temperature of the device.
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Inventors:
WANG PENG (US)
YAN BOHAN (US)
HE HUI (US)
YAN BOHAN (US)
HE HUI (US)
Application Number:
PCT/CN2022/102293
Publication Date:
January 04, 2024
Filing Date:
June 29, 2022
Export Citation:
Assignee:
QUALCOMM INC (US)
WANG PENG (US)
YAN BOHAN (US)
HE HUI (CN)
WANG PENG (US)
YAN BOHAN (US)
HE HUI (CN)
International Classes:
H05K7/20; H01L23/373
Domestic Patent References:
| WO2017003677A1 | 2017-01-05 |
Foreign References:
| US20210373628A1 | 2021-12-02 | |||
| CN105032518A | 2015-11-11 | |||
| US20210202349A1 | 2021-07-01 | |||
| US20220042750A1 | 2022-02-10 |
Attorney, Agent or Firm:
NTD PATENT & TRADEMARK AGENCY LTD. (CN)
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