Title:
CUTTING DEVICE, METHOD FOR MANUFACTURING GYPSUM BOARD, AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/026636
Kind Code:
A1
Abstract:
Provided is a cutting device with which, even if a plate body to be cut is warped, it is easy to obtain a cut item of the same quality as when a plate body which is not warped is cut. The cutting device is mounted on a conveyor for transporting a plate body, and cuts the plate body being transported by the conveyor. The cutting device comprises: a cutting blade for cutting the plate body in a direction parallel to the transporting direction; and, at a position on a side of the cutting blade, a pressure-applying part having a press plate arranged to be movable between a pressure-applying position for pressing the plate body and a retracted position retracted from the pressure-applying position. The cutting device cuts the plate body with the cutting blade while pressing the plate body with the press plate.
Inventors:
SOMENO HIROYUKI (JP)
ISHIBASHI HIDENORI (JP)
ISHIBASHI HIDENORI (JP)
Application Number:
PCT/JP2022/023472
Publication Date:
March 02, 2023
Filing Date:
June 10, 2022
Export Citation:
Assignee:
YOSHINO GYPSUM CO (JP)
International Classes:
B23D19/00; B23D47/00; B28B1/50; B28B11/14; B28D1/04; B28D7/04; E04C2/04
Foreign References:
| JPH08243982A | 1996-09-24 | |||
| JP2009291846A | 2009-12-17 | |||
| JPH06155402A | 1994-06-03 | |||
| JPH0319717A | 1991-01-28 | |||
| JP2008296523A | 2008-12-11 | |||
| JPS56126599A | 1981-10-03 | |||
| JPH08243982A | 1996-09-24 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
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