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Patent Searching and Data


Title:
CUTTING APPARATUS FOR ELECTRODE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/049133
Kind Code:
A1
Abstract:
A cutting apparatus for an electrode substrate, according to one embodiment of the present invention, comprises: a moving unit that guides a movement of an electrode substrate along a moving path; a defect detection unit that is disposed on the moving path and is provided to detect a defective portion of the electrode substrate; a cutting unit that is provided to cut the electrode substrate into a plurality of unit electrodes, is provided to be movable along the moving path, and is provided to have different cutting positions of a non-defective cutting position for cutting a non-defective electrode from among the plurality of unit electrodes and a defective cutting position for cutting a defective electrode therefrom including a defective portion; an electrode discharging unit that is provided to discharge a non-defective electrode cut at the non-defective cutting position to the outside; and a defect recovering unit that stores defective electrodes cut at the defective cutting position.

Inventors:
KIM YANG LAE (KR)
KIM WOONG KI (KR)
LEE YOUNG SOO (KR)
CHOI DONG SOON (KR)
HAN DO SEONG (KR)
PARK SANG EUN (KR)
Application Number:
PCT/KR2023/012708
Publication Date:
March 07, 2024
Filing Date:
August 28, 2023
Export Citation:
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Assignee:
LG ENERGY SOLUTION LTD (KR)
International Classes:
B65H35/06; B26D1/06; B26D1/09; B26D5/24; B26D5/28; B26D7/26; B65H20/02; B65H23/26; B65H43/04; H01M10/04
Foreign References:
KR20220112893A2022-08-12
KR20180119946A2018-11-05
KR20210147658A2021-12-07
JP3088761B22000-09-18
JP2019121536A2019-07-22
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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