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Title:
CURABLE RESIN COMPOSITION, CURABLE FILM, AND LAMINATED FILM
Document Type and Number:
WIPO Patent Application WO/2024/014432
Kind Code:
A1
Abstract:
This curable resin composition contains (A) a rubber component, (B) an epoxy-group-containing cross-linking component, (C) an ester-based curing agent, and (D) a curing accelerator.

Inventors:
OHKODA YOHEI (JP)
MASAKI TAKESHI (JP)
KAWAMORI TAKASHI (JP)
Application Number:
PCT/JP2023/025467
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
H05K3/28; B32B27/38; C08G59/40; C08K5/10; C08K5/3445; C08L21/00; C08L63/00
Domestic Patent References:
WO2021024364A12021-02-11
Foreign References:
JP2018150543A2018-09-27
JP2022022261A2022-02-03
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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