Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/070846
Kind Code:
A1
Abstract:
Provided is a curable composition which exhibits excellent solvent solubility and can be cured at a low temperature in the presence of oxygen. The curable composition according to the present disclosure contains: a compound (A) represented by formula (1); and a curing accelerator (B). The curing accelerator (B) is at least one type selected from the group consisting of a metaxylylenediamine reaction product, a quaternary phosphonium salt, a carboxyl group-containing phosphonium salt, a carboxyl group-containing 2-ethylhexanoic acid salt that is a thermally latent base generator, a secondary monoamine, an imidazole-based compound, and a low molecular weight maleimide.
Inventors:
MIKI AYANO (JP)
NAKATANI KOUJI (JP)
NAKATANI KOUJI (JP)
Application Number:
PCT/JP2023/034090
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
DAICEL CORP (JP)
International Classes:
C08G73/06; C08G65/48; H01B7/02
Foreign References:
| JP2022025705A | 2022-02-10 | |||
| JP2021095542A | 2021-06-24 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
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