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Title:
CURABLE COMPOSITION FOR INKJET USE AND FOR AIR CAVITY FORMATION, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2024/080336
Kind Code:
A1
Abstract:
Provided is a curable composition for inkjet use and for air cavity formation. The curable composition can form a cured product layer having a high aspect ratio, and can suppress the generation of outgassing even if exposed to high temperatures. This curable composition for ink jet use and for air cavity formation contains: a light- and heat-curable compound having a (meth)acryloyl group and a cyclic ether group; and a specific amount of a first light-curable compound which has three or more (meth)acryloyl groups and does not have a cyclic ether group, does not contain, or contains a specific amount of, a second light-curable compound which has one (meth)acryloyl group and does not have a cyclic ether group, and does not contain, or contains a specific amount of, a heat-curable compound which does not have a (meth)acryloyl group and has a cyclic ether group.

Inventors:
NAGANO SHO (JP)
WATANABE TAKASHI (JP)
TANIKAWA MITSURU (JP)
SUGISAWA YOSHIFUMI (JP)
Application Number:
PCT/JP2023/037080
Publication Date:
April 18, 2024
Filing Date:
October 12, 2023
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09D11/101; C09D11/30; C09J4/02; C09J163/00; H01L23/02; H01L23/29; H01L23/31
Domestic Patent References:
WO2022203033A12022-09-29
Foreign References:
JP2016147930A2016-08-18
JP2020182948A2020-11-12
JP2016196135A2016-11-24
Attorney, Agent or Firm:
OSAKA FRONT (JP)
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