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Title:
CURABLE COMPOSITION, CURED FILM, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084904
Kind Code:
A1
Abstract:
Provided is a curable composition that contains semiconductor particles (A), polymerizable compounds (B), a polymerization initiator (C), and an antioxidant (D). The polymerizable compounds (B) include, in an amount of 40 mass% or more with respect to the total amount of the polymerizable compounds (B), a polymerizable compound having a dipole moment in at least 3D.

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Inventors:
IWAWAKI HIROSHI (JP)
TOKUDA MASAYOSHI (JP)
Application Number:
PCT/JP2023/034842
Publication Date:
April 25, 2024
Filing Date:
September 26, 2023
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; G02B5/20; H10K50/125; H10K50/854; H10K59/38
Foreign References:
JP2020105491A2020-07-09
JP2020086074A2020-06-04
JP2017215470A2017-12-07
KR20210117047A2021-09-28
JP2013033833A2013-02-14
JP2023121726A2023-08-31
JP2016093956A2016-05-26
JP2021105710A2021-07-26
JP2009175647A2009-08-06
JP2008197613A2008-08-28
JP2003292798A2003-10-15
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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