Title:
COVER TAPE, COVER TAPE MANUFACTURING METHOD, COVER TAPE WEB ROLL, AND ELECTRONIC COMPONENT PACKAGING
Document Type and Number:
WIPO Patent Application WO/2024/085137
Kind Code:
A1
Abstract:
Provided is a cover tape that is used by being heat sealed onto the front surface of an electronic component conveyance-use carrier tape that intermittently includes, in the longitudinal direction, accommodation sections for accommodating electronic components, the heat sealing performed so as to seal the accommodation sections. The cover tape includes: a substrate layer; and a heat sealant layer which is provided to one surface of the substrate layer. The heat sealant layer is formed so as to extend in a strip shape at both ends of the substrate layer in the longitudinal direction thereof.
Inventors:
ABE HIROKI (JP)
Application Number:
PCT/JP2023/037504
Publication Date:
April 25, 2024
Filing Date:
October 17, 2023
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B65D85/86; B32B27/00; B32B27/18; B65D65/40
Domestic Patent References:
| WO2008154231A2 | 2008-12-18 |
Foreign References:
| JP2014532602A | 2014-12-08 | |||
| JPH11139488A | 1999-05-25 | |||
| JP2014513013A | 2014-05-29 | |||
| JP2003192022A | 2003-07-09 | |||
| JP2017105518A | 2017-06-15 | |||
| JP2021123419A | 2021-08-30 | |||
| CN101648622A | 2010-02-17 | |||
| KR20070101711A | 2007-10-17 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
Download PDF: