Title:
COVER FILM
Document Type and Number:
WIPO Patent Application WO/2024/070525
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a cover film having superior adhesion to a substrate when a bonded body of the cover film and the substrate is stored for a long period. The cover film according to the present invention comprises a support and a polymer layer containing a polymer, in which the support comprises cellulose triacetate derived from a wood pulp, and the polymer layer satisfying the following requirement 1. Requirement 1: the residual ratio of the polymer layer before and after the immersion of the polymer layer detached from the cover film in xylene at 25°C is 10 to 50% by mass.
Inventors:
NAKAMICHI AKI (JP)
SUZUKI TAKATO (JP)
SUZUKI TAKATO (JP)
Application Number:
PCT/JP2023/032321
Publication Date:
April 04, 2024
Filing Date:
September 05, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B23/08; B32B27/30; C08J7/04
Domestic Patent References:
| WO2021187262A1 | 2021-09-23 | |||
| WO2021187269A1 | 2021-09-23 | |||
| WO2022014374A1 | 2022-01-20 | |||
| WO2021251424A1 | 2021-12-16 |
Foreign References:
| JPS6238408A | 1987-02-19 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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