Title:
COUPLING DEVICE, COUPLING STRUCTURE, AND MANUFACTURING METHOD OF COUPLING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/172360
Kind Code:
A1
Abstract:
A coupling device 10 is provided with: a coupling member 50 that has an annular body portion 60 that covers the outer periphery of a site where pipes 11, 12 are coupled and an interposition portion 61 interposed between end faces 20 of the two pipes 11, 12; an electrically conductive member 51 that is provided on the outer peripheral surface of the coupling member 50 corresponding to the interposition portion 61 and generates heat by electromagnetic induction; and an annular cover member 52 that covers the electrically conductive member 51 from the outside. The coupling device 10 is further provided with an annular interposition member 53 that can be interposed between the outer peripheral surface of the site where the two pipes 11, 12 are coupled and the body portion 60 of the coupling member 50.
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Inventors:
KANAYAMA SADAAKI (JP)
Application Number:
PCT/JP2021/004962
Publication Date:
August 18, 2022
Filing Date:
February 10, 2021
Export Citation:
Assignee:
AXIS INC (JP)
International Classes:
F16L47/02
Domestic Patent References:
| WO2018167779A1 | 2018-09-20 | |||
| WO2020022178A1 | 2020-01-30 | |||
| WO2016145470A2 | 2016-09-22 | |||
| WO2015132783A2 | 2015-09-11 |
Foreign References:
| JP2001208274A | 2001-08-03 | |||
| CN208074308U | 2018-11-09 | |||
| JP2009536295A | 2009-10-08 | |||
| CN208935589U | 2019-06-04 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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