Title:
COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2024/009861
Kind Code:
A1
Abstract:
Provided are a copper-clad laminate that has excellent heat resistance and lowers transmission loss, a printed wiring board having the copper-clad laminate, and a semiconductor package. Specifically, provided is a copper-clad laminate or the like that includes an insulating layer containing a resin, and copper foil disposed on at least one surface of the insulating layer. The copper foil is surface-treated copper foil that has a surface roughness Rz of 0.30 to 0.60 μm at a surface thereof opposed to the insulating layer, and that has a metal treatment layer containing silicon of 80 to 300 μg/dm2.
Inventors:
SASAKI REN (JP)
YAGI SHIGEYUKI (JP)
KAMOSHIDA SHINICHI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
TAKEGUCHI AYAKA (JP)
YAGI SHIGEYUKI (JP)
KAMOSHIDA SHINICHI (JP)
KAKITANI MINORU (JP)
TANIGAWA TAKAO (JP)
TAKEGUCHI AYAKA (JP)
Application Number:
PCT/JP2023/023907
Publication Date:
January 11, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
B32B15/08; B32B15/20; H05K1/03
Domestic Patent References:
| WO2020017551A1 | 2020-01-23 | |||
| WO2021132191A1 | 2021-07-01 |
Foreign References:
| JP2016056452A | 2016-04-21 | |||
| JP2010202891A | 2010-09-16 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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