Title:
COOLING STRUCTURE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/085003
Kind Code:
A1
Abstract:
This cooling structure can comprise: a semiconductor device provided with a base material and a sealing resin; a cooler; and a joining material for joining the cooler and the base material. When seen in a first direction, the joining material can protrude outward of the sealing resin. The joining material can have a first surface and a second surface opposite to each other in the first direction. The first surface can be in contact with the base material. The second surface can be in contact with the cooler. The area of the second surface can be larger than the area of the first surface.
Inventors:
MOCHIZUKI YO (JP)
Application Number:
PCT/JP2023/036569
Publication Date:
April 25, 2024
Filing Date:
October 06, 2023
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L23/40; H01L23/473
Domestic Patent References:
| WO2022080055A1 | 2022-04-21 | |||
| WO2017094370A1 | 2017-06-08 | |||
| WO2017056360A1 | 2017-04-06 |
Foreign References:
| JP2009252886A | 2009-10-29 | |||
| JP2001516973A | 2001-10-02 | |||
| JP2017212376A | 2017-11-30 | |||
| JP2012142465A | 2012-07-26 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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