Title:
COOLER AND COOLING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/084551
Kind Code:
A1
Abstract:
The invention makes it possible to provide a cooler and a cooling system for efficiently cooling the heat generated from a heating element. A cooler (1) is for cooling a heating element (2). The cooler (1) is provided with: a case (20) having an outer surface to which the heating element (2) is provided and having an interior space into which a refrigerant flows; and fins (11) that protrude out from an inner surface of the case (20) and form a refrigerant flow path in the interior space. The fins (11) include: a plurality of columnar parts (12) arranged to be staggered; a plurality of planar parts (13) that interconnect columnar parts (12) that are adjacent in a flow direction F which is orthogonal to a height direction H of the case and in which the refrigerant flows; and a plurality of diagonally connecting parts (14) that interconnect columnar parts (12) that are adjacent in a diagonal direction diagonally intersecting with the flow direction F. Also, a cooling system (30) is provided with the cooler (1), a heat exchanger (40), a pump (50), and piping (60) connecting the foregoing.
Inventors:
ASAI YUGO (JP)
USHIFUSA HIROYUKI (JP)
USHIFUSA HIROYUKI (JP)
Application Number:
PCT/JP2022/038625
Publication Date:
April 25, 2024
Filing Date:
October 17, 2022
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/36; H01L23/473
Domestic Patent References:
| WO2019176620A1 | 2019-09-19 |
Foreign References:
| JP2016004806A | 2016-01-12 |
Attorney, Agent or Firm:
KURATANI, Yasutaka et al. (JP)
Download PDF:
Previous Patent: PRODUCTION MANAGEMENT DEVICE
Next Patent: INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD
Next Patent: INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD