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Title:
CONVERTER AND ANTENNA DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/235054
Kind Code:
A1
Abstract:
A first dielectric substrate (11) is provided on a surface of a second dielectric substrate (12), an end part on one side of a post wall waveguide (15) facing the surface, and an end part (A) of the first dielectric substrate (11) facing a slot (17). Metal plates (13a, 13b) comprise grooves (14a, 14b) having a depth equating to one-quarter of the propagation wavelength of a signal in a position (P2), which is separated from a position (P1) at which the post wall waveguide (15) is electrically short-circuited by one-quarter of the propagation wavelength of the signal.

More Like This:
WO/2019/220530SIGNAL TRANSMITTING STRUCTURE, METHOD FOR MANUFACTURING SIGNAL TRANSMITTING STRUCTURE, AND HIGH-FREQUENCY SIGNAL TRANSMITTING/RECEIVING DEVICE
JPS6462902MICROWAVE AMPLIFIER
Inventors:
USHIJIMA YU (JP)
UEDA RYO (JP)
UNNO TOMOYUKI (JP)
Application Number:
PCT/JP2019/020302
Publication Date:
November 26, 2020
Filing Date:
May 22, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01P5/08; H01P5/107
Foreign References:
JP2014022830A2014-02-03
JP2011061258A2011-03-24
JP2012256967A2012-12-27
US20160149311A12016-05-26
Other References:
KHATIB ET AL.: "Substrate-Integrated Waveguide Vertical Interconnects for 3-D Integrated Circuits", IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY, vol. 2, no. 9, September 2012 (2012-09-01), XP011463225, DOI: 10.1109/TCPMT.2012.2196516
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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