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Title:
CONNECTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/004591
Kind Code:
A1
Abstract:
A connector device (1) is provided with a circuit board (10) and a connector (20) installed on the circuit board (10). The connector (20) has an outer conductor (33) that can be electrically continuous with a shield layer (92) of a shield wire (90), a sub-substrate (35), an IC (36) that is mounted on the sub-substrate (35), and a heat transfer part (a heat dissipation sheet (61), a metallic plate (60), the outer conductor (33), a sub ground circuit (52)) that transfers heat from the IC (36) to the shield layer (92). According to this configuration, the heat from the IC (36) can be transferred to the shield layer (92) of the shield wire (90) via the heat transfer part, and consequently the heat from the IC (36) is easily released.

Inventors:
MIYAJO AKIRA (JP)
MASHITA MAKOTO (JP)
IWAMOTO TAKUYA (JP)
MORIGUCHI MASAKATSU (JP)
Application Number:
PCT/JP2023/021572
Publication Date:
January 04, 2024
Filing Date:
June 09, 2023
Export Citation:
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Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R13/66; H01R12/71; H05K7/20
Foreign References:
JP2001345151A2001-12-14
JP2019216022A2019-12-19
JP2007527095A2007-09-20
JP2014036033A2014-02-24
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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