Title:
CONNECTOR CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2024/057447
Kind Code:
A1
Abstract:
The present invention stabilizes an electric connection between a deformable circuit board and an external element. This connector connection structure electrically connects one end portion of a conductive pattern disposed on one surface of the deformable circuit board, with an external element, wherein a resin layer is integrated and fixed to a housing, the resin layer being formed so as to expose one end of an external connection terminal to be electrically connected to the external element on the inner surface of an opening portion formed at a base end portion of the housing, and cover the other surface on the opposite side to the one surface of the circuit board in a contact-hold state in which the one end portion of the conductive pattern is inserted into the opening portion so as to be electrically conductive with the one end of the external connection terminal.
Inventors:
NAKASHIMA TAKASHI (JP)
IIZUKA MINORU (JP)
KITAYAMA SHINGO (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)
IIZUKA MINORU (JP)
KITAYAMA SHINGO (JP)
YOKOYAMA HIDEAKI (JP)
OITA YUICHI (JP)
FUJIMAKI KIYOSHI (JP)
Application Number:
PCT/JP2022/034429
Publication Date:
March 21, 2024
Filing Date:
September 14, 2022
Export Citation:
Assignee:
ELEPHANTECH INC (JP)
TAKAHATA PREC CO LTD (JP)
TAKAHATA PREC CO LTD (JP)
International Classes:
H01R12/77; H01R43/00
Domestic Patent References:
| WO2019208091A1 | 2019-10-31 |
Foreign References:
| JPH08279667A | 1996-10-22 | |||
| JPH0644037U | 1994-06-10 | |||
| JP2008218118A | 2008-09-18 | |||
| US20160028174A1 | 2016-01-28 | |||
| JP7117705B1 | 2022-08-15 |
Attorney, Agent or Firm:
SEZAKI Yukinori (JP)
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