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Patent Searching and Data


Title:
CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/233458
Kind Code:
A1
Abstract:
A connection structure comprising a plurality of insulated electrical wires, a plurality of connected portions, and an adhesive. The insulated electrical wires each comprise a central conductor and an insulating layer covering the peripheral surface of the central conductor. At the axial-direction end of each of the insulated electrical wires, the central conductor is exposed without being covered with the insulating layer. The connected portions have been arranged in a stripe pattern. The ends of the insulated electrical wires have been bonded by soldering respectively to the connected portions. The adhesive is adherent to the lateral surface of the end of at least one of the insulated electrical wires.

Inventors:
YAMAMOTO MASAMICHI (JP)
NAKATSUGI KYOUICHIROU (JP)
KOINUMA TAKAYOSHI (JP)
MATSUMOTO MASAHIRO (JP)
HATTORI SHIHO (JP)
YOSHIDA NARUMI (JP)
Application Number:
PCT/JP2022/021908
Publication Date:
December 07, 2023
Filing Date:
May 30, 2022
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01R4/02; H01R43/02; H01R9/03; H01R12/52
Foreign References:
JP2013206617A2013-10-07
JP2010118318A2010-05-27
JP2011258460A2011-12-22
JP2011054442A2011-03-17
JP2007026846A2007-02-01
JP2015201280A2015-11-12
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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