Title:
CONDUCTIVE COMPOSITION, SINTERED COMPACT THEREOF, LAMINATED STRUCTURE, ELECTRONIC PART, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/070271
Kind Code:
A1
Abstract:
The problem addressd by this invention is to provide a conductive composition that can be sintered at low temperature and has low resistance, the composition forming a conductive film having excellent flexibility and bend resistance. Provided is a conductive composition comprising (A) surface-modified silver nanoparticles in which the surface is coated with a lower carboxylic acid, (B) a binder resin, and (C) an organic solvent, wherein the lower carboxylic acid of (A) the surface-modified silver nanoparticles present in the conductive composition starts desorption from the silver nanoparticles at 40 to 130 °C.
Inventors:
OTOMO MASAYOSHI (JP)
YONEDA TAKASHI (JP)
YONEDA TAKASHI (JP)
Application Number:
PCT/JP2023/029218
Publication Date:
April 04, 2024
Filing Date:
August 10, 2023
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L101/00; B22F1/00; B22F1/05; B22F1/102; B22F9/00; C08K9/04; H01B1/00; H01B1/22; H01B5/00
Domestic Patent References:
| WO2012060284A1 | 2012-05-10 | |||
| WO2012147945A1 | 2012-11-01 |
Foreign References:
| JP2011238596A | 2011-11-24 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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