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Patent Searching and Data


Title:
CONDUCTIVE COMPOSITION, CONDUCTIVE FILM, CONTACT MEMBER AND METHOD FOR PRODUCING CONDUCTIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/019923
Kind Code:
A1
Abstract:
The present invention provides: a conductive composition and a conductive film, each of which has a lower electrical resistance than ever before; a contact member; and a method for producing the conductive composition. A conductive composition according to the present invention contains an elastomer, a multilayer graphene and a conductive filler; and the multilayer graphene has a length of from 5 μm to 100 μm and a thickness of from 5 nm to 30 nm. In addition, a conductive film according to the present invention is formed of this conductive composition and constitutes a contact part of a contact member. In addition, a method for producing a conductive composition according to the present invention comprises: a step for mixing a liquid composition that contains a conductive filler and a solvent; and a step for blending and mixing an elastomer and a multilayer graphene into the liquid composition.

Inventors:
SASAKI RYOSUKE (JP)
TAKEUCHI AKIHITO (JP)
Application Number:
PCT/JP2020/022918
Publication Date:
February 04, 2021
Filing Date:
June 10, 2020
Export Citation:
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Assignee:
SEKISUI POLYMATECH CO LTD (JP)
International Classes:
H01B1/24; H01B1/04; H01B13/00; H01H1/06; H01H11/04
Domestic Patent References:
WO2017169627A12017-10-05
Foreign References:
JP2015185309A2015-10-22
JP2013245329A2013-12-09
Attorney, Agent or Firm:
OHTAKE Seigo (JP)
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