Title:
CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/014626
Kind Code:
A1
Abstract:
The present invention provides a conductive adhesive composition which is able to achieve a good bonding strength, while achieving a good thickness between adherends in cases where the blending amount of a conductive powder is relatively decreased. This conductive adhesive composition contains (A) a conductive powder and (B) a curable component; the content of the curable component (B) is 20 parts by mass or more, if the content of the conductive powder (A) is taken as 100 parts by mass; and this conductive adhesive composition additionally contains (C) spacer particles that have a larger average particle diameter (median diameter) than the conductive powder (A). The average particle diameter (median diameter) of the spacer particles (C) is within the range of from 10 μm to 60 μm; and the CV value of the spacer particles (C) is 30% or less. The content of the spacer particles (C) is from 0.01 part by mass to 30 parts by mass, if the total content of the conductive powder (A) and the curable component (B) is taken as 100 parts by mass.
Inventors:
ARAI TAKAMITSU (JP)
KASUGAI TAKAYUKI (JP)
OCHIAI NOBUO (JP)
TOMEKAWA SATORU (JP)
KASUGAI TAKAYUKI (JP)
OCHIAI NOBUO (JP)
TOMEKAWA SATORU (JP)
Application Number:
PCT/JP2021/026382
Publication Date:
January 20, 2022
Filing Date:
July 14, 2021
Export Citation:
Assignee:
KYOTO ELEX CO LTD (JP)
International Classes:
C09J9/02; C09J11/04; C09J11/08; C09J133/00; C09J163/00; C09J183/04; C09J201/00; H01B1/22; H01L31/0224; H01M14/00
Domestic Patent References:
| WO2016088664A1 | 2016-06-09 |
Foreign References:
| JP2017145382A | 2017-08-24 | |||
| JPH0237609A | 1990-02-07 | |||
| JPH07126489A | 1995-05-16 | |||
| JP2009037964A | 2009-02-19 | |||
| JP2010272725A | 2010-12-02 | |||
| JP2015185839A | 2015-10-22 | |||
| JP2011109149A | 2011-06-02 |
Attorney, Agent or Firm:
SHOSU Takeshi (JP)
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