Title:
COMPRESSION MOLDING APPARATUS AND MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2011/111718
Kind Code:
A1
Abstract:
Disclosed are a compression molding apparatus and a molding die, whereby efficient thermo-molding is performed. The compression molding apparatus (1) performs molding by applying a raw material (10) to the molding die, and applying heat and pressure to the material. The apparatus is provided with: a first molding die (3), which forms a molding frame that surrounds a region where the raw material (10) is compression-molded; a second molding die (6), which compresses the raw material (10) applied to the molding frame; and a heat source section (7), which supports and heats the second molding die (6). The second molding die (6) has: a first heat pipe (13), which has one end (16) positioned on the heat source section (7) side, and the other end (17) positioned on the side of a pressing surface (14) that presses the raw material (10); and a heat insulating layer (15), which wraps the first heat pipe (13) in the longitudinal direction of the first heat pipe (13).
Inventors:
SUGIE RIE
HOSHI TOSHIHIRO
MITA TADAHIRO
FUKUE KUNIHIRO
KODA ATSUSHI
AYABE KAZUYA
HOSHI TOSHIHIRO
MITA TADAHIRO
FUKUE KUNIHIRO
KODA ATSUSHI
AYABE KAZUYA
Application Number:
PCT/JP2011/055421
Publication Date:
September 15, 2011
Filing Date:
March 08, 2011
Export Citation:
Assignee:
AKEBONO BRAKE IND (JP)
SUGIE RIE
HOSHI TOSHIHIRO
MITA TADAHIRO
FUKUE KUNIHIRO
KODA ATSUSHI
AYABE KAZUYA
SUGIE RIE
HOSHI TOSHIHIRO
MITA TADAHIRO
FUKUE KUNIHIRO
KODA ATSUSHI
AYABE KAZUYA
International Classes:
B29C43/36; B29C33/02; B29L31/16; F16D69/00
Foreign References:
| JPH0591820U | 1993-12-14 | |||
| JPS6295210A | 1987-05-01 | |||
| JPS63111024A | 1988-05-16 | |||
| JP2005138366A | 2005-06-02 | |||
| JP2001018229A | 2001-01-23 | |||
| JP2003291182A | 2003-10-14 |
Attorney, Agent or Firm:
OGURI Shohei et al. (JP)
Shohei Oguri (JP)
Shohei Oguri (JP)
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Claims: