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Patent Searching and Data


Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/058246
Kind Code:
A1
Abstract:
Provided is a composition comprising acetylated wood flour. This acetylated wood flour is substantially free of an inorganic acid ester bonded to a cellulose backbone. Also provided is a method for the composition, the method comprising: treating wood flour under reduced pressure; immersing the reduced pressure-treated wood flour in a solvent containing an acetylating agent and applying a pressure at 10 bar or higher; and then applying a pressure of 1.1-1.9 bar absolute under an inert gas atmosphere to the solvent containing the wood flour and the acetylating agent while maintaining a temperature of 60-130°C to acetylate the wood flour.

Inventors:
YOSHIOKA MARIKO (JP)
RABEMANOLONTSOA HARIFARA FENOHASINA (JP)
SHIRAISHI NOBUO (JP)
KITAYAMA KENJI (JP)
Application Number:
PCT/JP2023/033529
Publication Date:
March 21, 2024
Filing Date:
September 14, 2023
Export Citation:
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Assignee:
UNIV KYOTO (JP)
DAICEL CORP (JP)
International Classes:
C08L97/02; C08L51/02
Foreign References:
JPS6239656A1987-02-20
JPS57103804A1982-06-28
JP2001342353A2001-12-14
JP2007084769A2007-04-05
JP2020196856A2020-12-10
JPS62225553A1987-10-03
JPH07216203A1995-08-15
JPH07304897A1995-11-21
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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