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Patent Searching and Data


Title:
COMPOSITION, MOLDED BODY, LAMINATE, AND RESIN
Document Type and Number:
WIPO Patent Application WO/2024/071211
Kind Code:
A1
Abstract:
The purpose of the present disclosure is to provide a composition, a molded body, a laminate, and a resin, wherein the agglomeration of fluororesin, which causes a poor strand appearance, can be suppressed even when the proportion of fluororesin is increased. The present disclosure pertains to a composition comprising fluororesin A and resin B (excluding the fluororesin A) which has a melt flow rate of 30 g/10 minutes at melting point + 12°C, wherein at least one of the fluororesin A or the resin B has a group (I) represented by the formula below. (In the formula, R1 and R2 are the same or different, represent hydrogen or an organic group, and may be bonded to each other to form a ring structure. A double line represented by a solid line and a broken line is a single bond or a double bond.)

Inventors:
TAKAHASHI TATSUHIRO (JP)
NUKUI TAKUYA (JP)
TOMIZAWA YUMA (JP)
YAMAGUCHI SHUHEI (JP)
FUKUSHIMA TOSHIYUKI (JP)
SEKI TOYOMITSU (JP)
KOMORI MASAJI (JP)
OKANISHI KEN (JP)
YAMAUCHI AKIYOSHI (JP)
Application Number:
PCT/JP2023/035179
Publication Date:
April 04, 2024
Filing Date:
September 27, 2023
Export Citation:
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Assignee:
UNIV YAMAGATA NAT UNIV CORP (JP)
DAIKIN IND LTD (JP)
International Classes:
C08L101/00; B32B15/082; B32B15/20; B32B27/30; C08L27/12; C08L67/00
Domestic Patent References:
WO2021039997A12021-03-04
WO2020226034A12020-11-12
WO2022044920A12022-03-03
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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