COMPOSITE PARTICLES FOR COMPOSITE DISPERSION PLATING AND METHOD OF PLATING THEREWITH

Title:

COMPOSITE PARTICLES FOR COMPOSITE DISPERSION PLATING AND METHOD OF PLATING THEREWITH

Document Type and Number:

WIPO Patent Application WO/1999/011843

Kind Code:

A1

Abstract:

A composite particle for composite dispersion plating used for forming a self-lubricating composite dispersion coating and a method of plating therewith; and a composite particle for composite dispersion plating which can be applied to plating and has an excellent capability of reducing the friction and a low or very low specific gravity and a method of plating therewith. In order to reduce the friction, the composite particle comprises a mother particle (1) encapsulated with child particle (2) comprising the same components as those of a base metal of a composite dispersion plating bath (5). This enables the provision of a composite particle for composite dispersion plating which has an excellent capability of reducing the friction and a low or very low specific gravity. Further, this particle can form a eutectic system in a plating layer without addition of any surfactant.

Inventors:

WAKAE TAKAYUKI (JP)
TSUJIMURA AKIRA (JP)
HARA YUICHIRO (JP)
KAMIMURA TADASHI (JP)
BEPPU MASAAKI (JP)
HIRAI EIJI (JP)
MORI SEIKI (JP)

Application Number:

PCT/JP1998/003950

Publication Date:

March 11, 1999

Filing Date:

September 03, 1998

Export Citation:

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Assignee:

ISUZU MOTORS LTD (JP)
NIHON PARKERIZING (JP)
WAKAE TAKAYUKI (JP)
TSUJIMURA AKIRA (JP)
HARA YUICHIRO (JP)
KAMIMURA TADASHI (JP)
BEPPU MASAAKI (JP)
HIRAI EIJI (JP)
MORI SEIKI (JP)

International Classes:

B22F1/02; C25D15/02; (IPC1-7): C25D15/02

Foreign References:

JPH0452300A	1992-02-20
JPH0841688A	1996-02-13

Other References: