Title:
COMPOSITE COPPER MEMBER AND POWER MODULE INCLUDING COMPOSITE COPPER MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/140063
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel composite copper member and a power module which includes the composite copper member. The composite copper member includes a copper member and a nickel layer which is formed on at least a partial surface of the copper member. The surface including the nickel layer has convex parts, wherein in a cross-sectional image of the composite copper member photographed using a scanning electron microscope, convex parts having a length of 50 nm to 1500 nm as measured in a direction parallel to the surface including the nickel layer are present in the quantity of 5 or more per 3.8 µm, and the nickel layer has a predetermined amount or a predetermined thickness of nickel. The power module includes the composite copper member and an insulating material which is bonded to the composite copper member at the surface including the nickel layer.
Inventors:
SATO MAKIKO (JP)
TOSAKA KENICHI (JP)
TERAKI SHIN (JP)
TOSAKA KENICHI (JP)
TERAKI SHIN (JP)
Application Number:
PCT/JP2022/048019
Publication Date:
July 27, 2023
Filing Date:
December 26, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C25D7/12; C25D5/12; H01L23/14
Domestic Patent References:
| WO2019093494A1 | 2019-05-16 |
Foreign References:
| JP2016191085A | 2016-11-10 |
Attorney, Agent or Firm:
ISSHIKI PATENT & TRADEMARK FIRM (JP)
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