Title:
COMPOSITE BOARD MOULDING METHOD AND COMPOSITE BOARD
Document Type and Number:
WIPO Patent Application WO/2019/100477
Kind Code:
A1
Abstract:
Provided are a composite board moulding method and a composite board. The method comprises the following steps: S11: processing multiple moulding slots (11) in at least one side surface of a base plate (10) in such a way that the moulding slots (11) run through one board surface of the base plate (10); S12: arranging the base plate (10), which is processed with the moulding slots (11), in a female mould (30) of a mould; S13: closing a male mould (40) and the female mould (30) such that the male mould (40) and the female mould (30) enclose an injection cavity (50); S14: injecting plastic (20) into the injection cavity (50), and filling the moulding slots (11) of the base plate (10) with the plastic (20); and S15: cooling the mould, so that the base plate (10) and the plastic (20) are combined into the composite board. The moulding slots (11) are filled with the plastic (20), such that binding capacity is improved, and it is not easy for cracks to appear at junctions of the plastic (20) and the moulding slots (11). Therefore, a process of repairing with an adhesive at the cracks is avoided; in addition, no cracks are produced at the junctions, so that the appearance of the formed composite board is of relatively high quality.
Inventors:
WU YUNFENG (CN)
HUANG MENGKAI (CN)
ZHANG SHUWEI (CN)
HUANG MENGKAI (CN)
ZHANG SHUWEI (CN)
Application Number:
PCT/CN2017/116820
Publication Date:
May 31, 2019
Filing Date:
December 18, 2017
Export Citation:
Assignee:
HEFEI LCFC INFORMATION TECHNOLOGY CO LTD (CN)
International Classes:
B29C45/14; F16S1/10; B29L7/00
Foreign References:
| CN106358393A | 2017-01-25 | |||
| CN106626228A | 2017-05-10 | |||
| CN2779977Y | 2006-05-17 |
Attorney, Agent or Firm:
KINGSOUND & PARTNERS (CN)
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